一、联系方式
通讯地址:福建省福州市福州地区大学新区学园路2号 邮编:350116
电子邮箱:huangyuhua.at.fzu.edu.cn
二、教育工作经历
2023/05-至今,304永利登录入口,304永利登录入口,副教授
2019/09-2023/06,华中科技大学,机械工程学院,博士
2017/07-2019/08,工业和信息化部电子第五研究所,项目工程师
2015/08-2017/07,哈尔滨工业大学,材料科学与工程学院,硕士
2011/09-2014/01,哈尔滨工业大学,材料科学与工程学院,学士
四、研究领域
1)微纳制造工艺与先进电子封装:超快激光工艺和第三代半导体、MEMS、2.5D/3D封装等
2)电子封装可靠性检测技术:光学(光谱)、视觉、超声、破坏性物理分析等
3)机器学习驱动微尺度模拟:微结构拓扑特征化方法、机器学习加速纳-微-宏多尺度仿真等
五、主要科研项目
1)福建省中青年教师教育科研项目(科技类),在研,主持;
2)304永利登录入口科研启动项目,在研,主持;
3)国家自然科学基金面上项目,在研,参与;
4)国家自然科学基金区域创新发展联合基金,在研,参与
5)XXX共性课题,结题,主持;
六、代表性论著
论文:
[1]Chen H, Wang C, Chen J, Xie Y, Sun K,Huang Y*, Zhu F. Changing torque-force synchronization condition for abrasive particle improves material removal during silicon carbide abrasive machining.Tribology International. 2024 192(4):109247.
[2]Huang Y, Zhou Y, Li J, Zhu F*. Materials removal mechanism and multi modes feature for silicon carbide during scratching[J].International Journal of Mechanical Sciences, 2022, 235: 107719.
[3]Huang Y, Zhou Y, Li J, Zhu F*. Femtosecond laser surface modification of 4H-SiC improves machinability[J].Applied Surface Science, 2023, 615: 156436.
[4]Huang Y, Zhou Y, Li J, Zhu F*. Femtosecond laser surface modification coupling with surface metallurgical reaction promotes surface plasticity of SiC[J].Journal of Materials Processing Technology, 2023, 319: 118077.
[5]Huang Y, Wang M, Li J, Zhu F*. Removal behavior of micropipe in 4H-SiC during micromachining[J].Journal of Manufacturing Processes, 2021, 68: 888–897.
[6]Huang Y, Wang M, Xu Y, Zhu F*. Investigation on gallium nitride with N-vacancy defect nano-grinding by molecular dynamics[J].Journal of Manufacturing Processes, 2020, 57: 153–162.
[7]Huang Y, Wang M, Li J, Zhu F*. Effect of inclusion on 4H-SiC during nano-scratching from an atomistic perspective[J].Journal of Physics: Condensed Matter, 2021, 33(43): 435402.
[8]Huang Y, Zhou Y, Li J, Zhu F*. Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations[J].Diamond and Related Materials, 2023, 137: 110150.
[9]Huang Y, Wang M, Xu Y, Zhu F*. Investigation of vibration-assisted nano-grinding of gallium nitride via molecular dynamics[J].Materials Science in Semiconductor Processing, 2021, 121: 105372.
[10]Huang Y, Zhou Y, Li J, Zhu F*. Understanding the role of surface mechanical properties in SiC surface machining[J].Materials Science in Semiconductor Processing, 2023, 163: 107594.
[11]Huang Y, Wang M, Li J, Zhu F*. Effect of abrasive particle shape on the development of silicon substrate during nano-grinding[J].Computational Materials Science, 2021, 193(3): 110420.
专利:
[1]一种基于散斑结构光的微电子基板翘曲测量方法和系统. 2021-05-28
[2]一种融合红外信息的应变场和温度场耦合测量方法及系统. 2021-03-26.
[3]基于视觉传感的激光增材制造缺陷的在线诊断方法. 2020-06-30.
[4]激光熔覆过程中的缺陷在线诊断方法. 2020-03-31.
[5]用于半导体集成电路粒子碰撞噪声试验的夹具及试验方法. 2019-02-26.
[6]缓解气密封装元器件密封细检漏试验氦气吸附程度的方法.2019-01-04.
七、研究生招生说明
热忱欢迎有志于先进电子制造与智能检测方向的本科生、研究生加入,团队注重理论和实践相结合,既欢迎天马行空、思维活跃的探索者,也欢迎脚踏实地、精益求精的实践者。